集成电路(IC)行业高精度光刻掩模版
产品概述:
可提供多种尺寸和规格的IC行业专用光刻掩模版,制作精度覆盖0.13um,0.18um,0.25um,0.35um,0.5um及以上芯片工艺节点(node),最小图形制作高达0.5um,制作精度+/-0.03um,如下表:
Mask grade |
A |
B |
C |
D |
E |
F |
G |
H |
I |
J |
Design rule |
>2.0 |
2.0 |
1.5 |
1 |
0.8 |
0.5 |
0.35 |
0.25 |
0.18 |
0.13 |
CD mean to target (um) |
±0.3 |
±0.25 |
±0.2 |
±0.10 |
±0.10 |
±0.07 |
±0.05 |
±0.04 |
±0.03 |
±0.02 |
CD tolerance (um) |
±0.3 |
±0.25 |
±0.2 |
±0.10 |
±0.10 |
±0.07 |
±0.05 |
±0.04 |
±0.03 |
±0.02 |
CD range (um) |
0.25 |
0.20 |
0.15 |
0.15 |
0.12 |
0.1 |
0.06 |
0.04 |
0.05 |
0.02 |
Defect size (um) |
<2 |
<1.5 |
<1 |
<0.8 |
<0.75 |
<0.5 |
<0.35 |
<0.25 |
<0.28 |
<0.20 |
同时,公司可提供专业的Pellicle Remount(重贴膜)服务,覆盖ASML,NIKON,CANNON等主流光刻机类型。